Can be used without issues in a standard configuration
Cube Case Temperature Evaluation Test
Additional thermal countermeasures using a heatsink panel are also available
A camera was installed inside the cube case, and an evaluation test was conducted under conditions using a heatsink structural panel to assess the internal temperature changes of the enclosure as well as the heat dissipation performance of the heatsink panel.
Do you have any of these concerns?
Will heat build up inside the enclosure?
Is it suitable for long-term operation?
Is a heatsink necessary?
Test Results
Stable operation is possible under typical conditions even with the standard configuration.
CPU Temperature: Within acceptable range
Internal Temperature: No issues detected
Further temperature reduction is possible with a heatsink panel.
For operation under higher loads or in high-temperature environments, where thermal stability may be a concern, using a heatsink panel can provide an effective solution.
Test Conditions: 2.64 W Industrial Camera
Heatsink Panels: 1 piece
Cooling Structure
| Components | Specifications |
| External Heatsink: 1 piece | Material: AL6063 Fin Height: 15 mm Fin Pitch: 5.25 mm Base Thickness: 4.5 mm |
| Internal Fan | Sunon MF30151V3-1000C-A99 20mA |
Heatsink Panels: 3 pieces
Cooling Structure
| Components | Specifications |
| External Heatsink: 3 piece | Material: AL6063 Fin Height: 15 mm Fin Pitch: 5.25 mm Base Thickness: 4.5 mm |
| Internal Fan | Sunon MF30151V3-1000C-A99 20mA |
Test Environment
8-tatami Western-style room. Window opened approximately 10 cm.
When the room temperature rose, the air conditioner was operated (set to 30°C, low fan speed).
Equipment Used
| Item | Details |
| Camera | SIP-K676K5 |
| Image Sensor | SONY IMX676 |
| Processor | Hi3519DV500 |
| Camera Power Consumption | 2.64 W |
| PoE Board | XR-PM3812AT |
| PoE Board Power Consumption | Approx.0.3 W |
| Total System Power Consumption | Approx.2.9 W |
| Cube Case | Cube Case 100 |
Measurement Results
| Measurement Item | Temperature Range |
| Ambient Temperature | 18〜31℃ |
| Inside Housing | 32〜43℃ |
| CPU Area | 37〜51℃ |
Based on the Measurement Results
The results confirm that the internal temperature of the enclosure remains approximately +13°C higher than the ambient temperature.
Additionally, similar results were obtained when increasing the number of heatsink panels from one to three.
From this, it can be concluded that under the test conditions, a single heatsink panel provides sufficient heat dissipation performance.
For systems with higher heat generation, further improvement in thermal performance can be expected by increasing the number of heatsink panels.
Request a Quote / Contact Us
f you would like a quotation based on product pricing or order quantity, please contact us here.
We will propose the optimal configuration tailored to your specific application and requirements.
For technical inquiries—such as specifications, installation methods, or compatibility with supported devices—please feel free to reach out as well.
Our specialists will support you from pre-deployment planning through to operational use.