Entaniya Silent Mount
Heatsink for Waterproof Cases and Enclosures
This product is a heatsink designed for sealed enclosures, allowing internal heat to be dissipated to the outside when mounted to the case.
Designed with an O-ring sealing structure for compatibility with waterproof enclosures.
It adopts an O-ring sealing structure, making it suitable for waterproof housings and other enclosures requiring a high level of airtightness.
O-ring floating vibration isolation mount structure
Vibration-reducing fan structure that suppresses vibration and resonance noise
To improve heat dissipation efficiency, forced convection of the internal air is essential.
This system promotes air circulation within a sealed environment by incorporating a vibration-isolated fan structure, which suppresses vibration and resonance noise and ensures stable cooling performance even inside airtight housings.
For 30 × 30 × 15 mm fan
Compatible fans:
MF30150V3-1000C-A99
MF30151V3-1000C-A99
Fan specifications (reference)
Size: 30 × 30 × 15 mm
Rated voltage: DC 5 V / DC 12 V
Airflow: 2.7 – 2.8 CFM
Speed: 4600 – 5200 rpm
Static pressure: 0.05 inch-H₂O
Noise: 7.8 – 9.8 dB(A)
Current consumption: 45 mA (5 V) / 20 mA (12 V)
Weight: 9.7 g
Bearing: SUNON MAGLev® magnetic levitation bearing
Heat Dissipation Performance Verification
A verification test was conducted to evaluate the heat dissipation performance of a high-power industrial camera installed in a waterproof camera housing (ASA resin) with external dimensions of 80 × 80 × 60 mm, equipped with a heatsink.
First, the system was left with the fan turned off until the camera temperature stabilized.
The thermometer readings were as follows:
Left thermometer (21.1°C): Ambient room temperature
Center thermometer (58.4°C): Camera temperature
Right thermometer (37.4°C): Temperature inside the camera housing
From this condition, the fan was activated to verify the heat dissipation performance.
The camera used in the test was a 4K camera manufactured by SEMSEC, with a power consumption of 3.5 W.
Equipment Used
| Camera | SIP-K676K5 |
| Image Sensor | SONY IMX676 |
| Processor | Hi3519DV500 |
| Camera Power Consumption | 2.64 W |
| PoE Board | XR-PM3812AT |
| PoE Board Power Consumption | 約0.3 W |
| Total System Power Consumptio | 約2.9 W |
Test Environment
An 8-tatami Western-style room.
The window is opened approximately 10 cm.
When the room temperature rises, the air conditioner is operated (set to 30°C, low fan speed).
Cooling Structure
| External Heat Sink | Material: AL6063 Fin Height: 15 mm Fin Pitch: 5.25 mm Base Thickness: 4.5 mm |
| Internal Fan | Sunon MF30151V3-1000C-A99 |
Test Results
| Measurement Item | Temperature Range |
| Ambient Temperature | 21〜32℃ |
| Inside Housing | 41〜52℃ |
| CPU Area | 45〜55℃ |
By Ambient Temperature Estimated Temperatur
| Ambient Temperature | Inside Housing | CPU Area |
| -30℃ | -10℃ | -5℃ |
| -20℃ | 0℃ | 5℃ |
| -10℃ | 10℃ | 15℃ |
| 0℃ | 20℃ | 25℃ |
| 10℃ | 30℃ | 35℃ |
| 20℃ | 40℃ | 45℃ |
| 30℃ | 50℃ | 55℃ |
| 40℃ | 60℃ | 65℃ |
| 50℃ | 70℃ | 75℃ |
Assembly Instructions
When assembling the vibration-resistant fan structure, please use a thread-locking adhesive (LOCTITE 243) on the screws.
If a thread-locking adhesive is not used, the screws securing the fan may loosen due to vibration.
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About Quantity Discounts
We offer a quantity discount service for corporate customers. If you are considering purchasing in large quantities, please contact us in advance using the inquiry form below. Please note that the discount varies depending on the type of product, selling price, quantity, and time of purchase.